Abrasive Processing and Polishing Technology. Chemical Mechanical Polishing Technology for Silicon Wafer.

Wafer Scale Variation of Planarization Length in Chemical Mechanical Polishing

Chemical mechanical polishing (CMP) is widely used for pla-narization of advanced interconnect and shallow trench isolation structures in integrated circuit manufacture. Of particular concern is within-die variation in the interlevel dielectric or oxide thickness remaining after polish, due to pattern density variations across the die. 1 Recent modeling of CMP has shown that a " planarization l...

Laser Assisted Chemical Mechanical Polishing for Planarization

Modeling of Polishing Mechanism in Magnetic Abrasive Polishing

Magnetic Abrasive Polishing (MAP) is a super-finishing process primarily used for polishing of nonmagnetic and hard materials like, ceramics and stainless steel. This paper deals with the detailed parametric study in polishing of stainless steel work surface. Statistically designed experiments based on Taguchi methods show that size-ratio, tool-work surface clearance, polishing speed, magnetic ...

Shallow Trench Isolation (STI) Chemical Mechanical Polishing (CMP) Process for Advanced Logic Technology

Shallow trench isolation (STI) requires a high quality oxide with superior fill capability provided by High Density Plasma (HDP) oxide. Unfortunately, the HDP deposition process can create large within die topographies that are difficult to polish directly using conventional silica slurries [1]. High Selective Slurries (HSS) were introduced in order to meet these stringent requirements and they...

Chemical Mechanical Polishing Slurry for Tungsten in Ulsi with Large Particle Size Colloidal Silica Nano-abrasive

Silica sol nano-abrasives with large particle are prepared and characterized by TEM, PCS and Zeta potential in this paper. Results show that the silica sol nano-abrasives about 100nm are of higher stability (Zeta potential: -65mV) and narrow distribution of particle size. And then alkali CMP slurries for tungsten containing self-made silica sol nanoabrasives are prepared and applied. CMP result...